| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composite electronic component which is small, and has stable high frequency characteristics. <P>SOLUTION: This composite electronic component has manufacturing steps comprising a step for forming inner wiring layers and via hole conductors in a multilayered substrate composed of a plurality of laminated insulating layers, a step for forming a recessed storage part in the main surface of the multilayered substrate and electrode pads around an opening of the storage part, a step for housing electronic component elements in the storage part and connecting the electronic component elements with the electrode pads through bonding wires, and a step for forming in the storage part conductive patterns extending from the electrode pads to the bottom face of the storage part through sidewalls of the storage part. In the bottom region of the storage part, the conductive patterns are connected to the via hole conductors. <P>COPYRIGHT: (C)2003,JPO</p> |
