| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free glass and a glass ceramic capable of producing electronic circuit boards with a low dielectric constant and a low dielectric loss by firing at 900°C or less. SOLUTION: The lead-free glass practically comprises 40-55 mol% of SiO<SB>2</SB>, 2-10 mol% of Al<SB>2</SB>O<SB>3</SB>, 32-39 mol% of MgO, and 1-15 mol% of ZnO. The glass ceramic composition practically comprises 40 mass% or more of the lead-free glass powder and inorganic powder having 1,000°C or higher of the melting point or the glass transition point. COPYRIGHT: (C)2003,JPO
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