| 发明名称 |
LIGHT EMITTING DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which emission efficiency is prevented from lowering and deterioration is suppressed by enhancing dissipation efficiency of heat generated from a light emitting diode. <P>SOLUTION: A light emitting diode chip 2 is face down mounted on a wiring board 1. The wiring board 1 comprises a conductor plate 11 on which a conductor layer 12 is formed through an insulation layer 13. One electrode of the light emitting diode chip 2 is connected with the conductor layer 12 and the other electrode is connected with the conductor plate 11 through a solder bump 21a as a heat transmitting member. Heat generated from the light emitting diode chip 2 is thereby transmitted to the conductor plate 11 through the bump 21a and dissipated efficiently through the conductor plate 11. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003168829(A) |
申请公布日期 |
2003.06.13 |
| 申请号 |
JP20020019260 |
申请日期 |
2002.01.28 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
NODA WATARU;KUZUHARA KAZUNARI;SUGIMOTO MASARU;KIMURA HIDEYOSHI;HASHIMOTO TAKUMA;SHIOHAMA EIJI |
| 分类号 |
H01L23/28;H01L21/60;H01L23/29;H01L23/31;H01L23/34;H01L23/36;H01L23/373;H01L23/40;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L23/28 |
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