发明名称 RESIGN DIAMOND BLADE AND METHOD OF MANUFACTURING OPTICAL WAVEGUIDE USING THE BLADE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide in which the end face is ground at the same time of a dicing. SOLUTION: The method of manufacturing a silicon-based optical waveguide includes a step in which a silicon wafer having a plurality of optical waveguides formed inside is prepared, a step in which a cut groove is formed on the silicon wafer by performing a first dicing by using a first resign diamond blade having a thickness t1, and a step in which the end face of the optical waveguide is ground by performing a second dicing on the silicon wafer along the cut groove by using a second resign diamond blade having a thickness t2 which is larger than t1. It is necessary that the second resign diamond blade includes diamond abrasive grain of which size is 2μm or smaller and the relation t1+0.01 mm≤t2≤t1+0.05 mm is satisfied. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003172839(A) 申请公布日期 2003.06.20
申请号 JP20010370603 申请日期 2001.12.04
申请人 FUJITSU LTD 发明人 MAEDA AKIO;SHIOTANI TAKASHI
分类号 G02B6/13;B24B19/22;B24B27/06;B24D3/00;B24D3/28;B24D5/12;B28D5/02;B81C1/00;G02B6/12;H01L21/00;H01L21/301;(IPC1-7):G02B6/13 主分类号 G02B6/13
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