| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring plate excellent in a wiring density, and a semiconductor mounting substrate as well as a semiconductor package which are employing the wiring plate, and the manufacturing method of the wiring plate, the manufacturing method of the semiconductor mounting substrate as well as the manufacturing method of the semiconductor package, which are simplified in a process, low in a cost and high in a connecting reliability. SOLUTION: The wiring plate is provided with an in-layer substrate on which an in-layer wiring is formed, a thin film built-up layer having an adhesive layer and an insulation resin layer at least on one side of the in-layer substrate, and a wiring formed on the insulation resin layer while the wiring and at least the in-layer wiring are connected through via holes. The wiring, formed on the insulation resin layer, is constituted of a spatter metallic layer and a pattern electric plating layer utilizing the spatter metallic layer as a substrate metal. COPYRIGHT: (C)2003,JPO |
