| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for pin lamination capable of excluding irregularities on a multi-layer print wiring plate. SOLUTION: The method of pin lamination comprises (a) a step wherein a plurality of steel plates 31 and copper layers 32 are prepared in a clean room while a plurality of prepregs 91 and cores 92 are prepared in a work room; (b) a step wherein a first sheet of the copper layer 32, whose luster surface is faced upward, one sheet of the steel plate 31 and the second sheet of the copper layer 32, whose luster surface is faced downward, are continuously laminated to prepare a sandwich type lamination board 20 or the step, wherein the steel plate 31 is pinched between two sheets of the copper layer 32 so that the luster surface of two sheets of the copper layer 32 is faced to the side of the steel plate 31; and (c) a step wherein the sandwich type lamination board 30 is transferred into the work room to continuously laminate the sandwich type lamination board 30, the prepreg 91 and the core 92 to provide a multi- layer board B. COPYRIGHT: (C)2003,JPO |
