| 摘要 |
A method for selective deposition of integrated circuit thin film, the method comprising: providing a substrate having a surface in a deposition chamber; depositing a photosensitive film on the substrate surface; selectively exposing a portion of the film to UVL (ultraviolet light), thereby creating an exposed film portion and an unexposed film portion; providing, in the deposition chamber, a mist of liquid precursor particles having a first polarity; and utilizing the first polarity to migrate the mist particles to one of either the exposed film portion or the unexposed film portion.
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