| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new organometallic compound and a method for forming a metal pattern using the compound. <P>SOLUTION: This organometallic compound for forming the metal pattern is represented by chemical formula (1) L'-M-L (1) (wherein, M is one kind of transition metal selected from the group consisting of Ag, Au, Cu, Pd, Ni and Pt: L is an imidazolylidene compound having a specific structure; and L' is an imidazolylidene compound having a specific structure or a β-diketonate having a specific structure). Since L', M and L are present on the nearly same plane, the compound is capable of reducing the bulkiness of an organic ligand which is the largest cause of metal film shrinkage. Furthermore, L' and L have characteristics of readily degrading and eliminating the ligand with light. Thereby, cracking can be suppressed when the metal pattern is formed. <P>COPYRIGHT: (C)2003,JPO |
