| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat resistant resin composition capable of forming a pattern with an aqueous alkali solution and having positive photosensitivity and to provide a heat resistant pattern forming method using the same. <P>SOLUTION: The photosensitive resin composition is characterized in that is comprises (A) a photosensitive polymer having a repeating unit of formula (1) (where R<SP>1</SP>and R<SP>2</SP>are each an aromatic group or an organic group comprising a plurality of aromatic rings bonded through a single bond or -O-, -CO-, -SO<SB>2</SB>-, -CH<SB>2</SB>- or -C(CF<SB>3</SB>)<SB>2</SB>-; R<SP>3</SP>is alkyl; and n is an integer of ≥1), (B) a photoacid generator which is converted to an acidic compound under an actinic ray and (C) a solvent. In the positive pattern forming method, a coating film of the composition is exposed, developed with an aqueous alkali solution and imidated. <P>COPYRIGHT: (C)2003,JPO |
