发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a thermal acid generating agent and a method of forming patterns using the same. <P>SOLUTION: The resin composition contains 100 parts by weight alkali-soluble acrylic copolymer, 5 to 100 parts by weight 1,2-quinone diazide compound, 2 to 35 parts by weight nitrogen-containing crosslinking agent and 0.1 to 10 parts by weight thermal acid generating agent to generate an acid by heat. The photosensitive film patterns are manufactured by applying the photosensitive resin composition onto a base material and drying the coating to manufacture a photosensitive film, then inserting a mask of a prescribed shape and performing exposure and development. When the resulted photosensitive patterns are cured by heating, the thermally cured patterns substantially free of a heat flow are formed. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003207891(A) 申请公布日期 2003.07.25
申请号 JP20020317448 申请日期 2002.10.31
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RI YUKYO;KYO SEITETSU;SHU SHINGO;RI TOKI
分类号 G03F7/033;G03F7/004;G03F7/008;G03F7/022;G03F7/023;G03F7/40;H01L21/027 主分类号 G03F7/033
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