METHOD FOR MANUFACTURING MULTIPLE CHIP RESISTOR

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a fine multiple chip resistor which eliminates the need for the size classification of individual substrates as in the case of a conventional method and by which a manufacturing process can be simplified.

SOLUTION: Edge electrodes 19 are formed in parts adjacent to slits on the reverse side of a substrate in sheet form, on the edges of the substrate in sheet form inside a plurality of slits and on the edges of an upper surface electrode layer by a thin-film technique from the reverse side of the substrate in sheet form. Then the substrate in sheet form is cut along the plurality of slits into strip substrates 11b. After that, unwanted parts of the edge electrodes 19 formed on the strip substrate 11b are removed by a laser for preventing a plurality of resistors provided on the individual substrates from being conductive with each other.

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