Electroless gold plating solution

摘要

An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 mug/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.