| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which is capable of suppressing a change in size of a mask material for exposure, by using a glass substrate formed with a mask pattern as the mask material for exposing, and thereby can prevent positional deviation of via holes, a plating resist pattern, and a solder resist pattern. <P>SOLUTION: A photosensitive resin layer 6 is formed on a wiring board PC. Then, the photosensitive resin layer 6 is exposed to light via the glass substrate 13 drawn with the mask pattern 14, and then is developed to form openings for forming the via holes. Thereafter, a conductor circuit and the via holes are formed on the photosensitive resin layer. The resist pattern is also formed by forming the photosensitive resin layer 6 on the wiring board PC and exposing the photosensitive resin layer 6 via the glass substrate 13 drawn with the mask pattern 14 and then developing the exposed photosensitive resin layer 6. <P>COPYRIGHT: (C)2003,JPO</p> |
