| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the deviation of alignment between an inner lead and a projected electrode of a semiconductor chip resulting from the fluctuation of the manufacturing a film substrate. <P>SOLUTION: A distance A up to the other end from one end of a line of the output side inner lead 5a of a film substrate, a distance B up to one end of a line of the input side inner lead 5a from one end of a line of the output side inner lead 5a, a distance C up to the other end of a line of the input side inner lead 5a from one end of a line of the output side inner lead 5a, a distance between A and B up to one end of a line of the input side inner lead 5a from the other end of a line of the output side inner lead 5a, a distance between A and C up to the other end of a line of the input side inner lead 5a from the other end of a line of the output side inner lead 5a, and a distance between C and B up to one end from the other end of a line of the input side inner lead 5a are measured. When these sizes A, B, C, A-B, A-C and B-C are within the allowance of the alignment of the inner lead 5a and an Au bump, the film substrate is determined as a good product. <P>COPYRIGHT: (C)2003,JPO</p> |
