| 摘要 |
PROBLEM TO BE SOLVED: To suppress deterioration in a solder junction obtained by using Sn-Zn- Bi based Pb-free solder with the lapse of time. SOLUTION: The solder paste is obtained by incorporating solder alloy powder and metal powder into flux. The solder alloy powder contains Sn, Zn and Bi as constituting elements, and the metal powder contains at least one constituting element selected from Fe and Co. COPYRIGHT: (C)2003,JPO
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