| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, which is capable of ensuring dimensional stability for a conductor pattern formed at a fine pitch, removing limitations imposed on processes as for the selection of materials, and reducing a production cost and to provide the multilayer wiring board. <P>SOLUTION: A second wiring board 22 and an adhesive material layer 23 formed on a metal support sheet 40 are partially laminated on a prescribed region of a first wiring board 21 by the use of the support sheet 40. After the second wiring board 22 is laminated, lastly the support sheet 40 is removed by etching. The second wiring board 22 is laminated only on a part of the first wiring board 21 which is required to get multilayered so as to reduce the amount of component materials used for the second wiring board. <P>COPYRIGHT: (C)2004,JPO</p> |
