| 摘要 |
A cleaning composition and method for removing built-up residue and scum on a substrate. The cleaning composition contains a compound of formula: R-[O-(AO)n]m-Z where R is a hydrophobe, AO is a hydrophile, Z is a nonionic or anionic capping group, n is an integer of from 1 to 200 and m is an integer of from 1 to 3. The cleaning composition and method is effective for removing built-up residue and scum deposited by both positive-working photoresist and negative-working photoresist. Such residue and scum contain photoinitiators, dyes, and (meth)acrylic monomers.
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