发明名称 Multi-stage-heating thermal reactor for transport polymerization
摘要 A multi-stage transport polymerization ("TP") reactor useful for making a thin film for the fabrication of integrated circuits. One TP reactor has two distinct heating zones that facilitate the cracking of specific precursor materials. The multi-stage reactor comprises a first low temperature heating zone that heats incoming precursor materials to a temperature that is lower than the "cracking" temperature of the precursor. The second heating zone is maintained at a temperature useful for breaking the chemical bonds of a desired leaving groups in the selected precursor. Specialized heating bodies, which transfer heat to the precursor material in the low and high temperature zones, are used as elements of the invention that can simultaneously decrease the total volume and increase the inside surface area of the TP reactor. Chemistries of precursors used in the multi-stage reactor are also provided.
申请公布号 US2003198578(A1) 申请公布日期 2003.10.23
申请号 US20020125626 申请日期 2002.04.18
申请人 DIELECTRIC SYSTEMS, INC. 发明人 LEE CHUNG J.;NGUYEN OANH;KUMAR ATUL;WU JEFF;SOLOMENSKY MICHAEL;CHANG JAMES YU CHUNG;NGUYEN BINH
分类号 B01J19/18;B05D7/24;C23C16/452;F28D17/00;(IPC1-7):F28D17/00 主分类号 B01J19/18
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