| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer wherein the scattering of cutting scraps is reduced in cutting processes to individual semiconductor elements and damages to the semiconductor elements and a dicing plate caused by the cutting scraps are eliminated. <P>SOLUTION: In a semiconductor wafer which is cut out in a prescribed thickness from a cylindrical semiconductor single crystal which has an element forming surface, a back surface and a side surface, after or before polishing is performed at least on the surface, a beveled top is arranged on the side surface approaching the back surface side by side surface grinding. <P>COPYRIGHT: (C)2004,JPO</p> |
