SUBSTRATE FOR SEMICONDUCTOR PACKAGE, THE SEMICONDUCTOR PACKAGE AND LAMINATE THEREOF USING THE SAME, AND MANUFACTURING METHODS FOR THEM

摘要

PROBLEM TO BE SOLVED: To provide a substrate for semiconductor package suitable for thinning, weight-saving and densification by using a low-cost functional film, and to provide a semiconductor package and lamination thereof using the substrate, and to provide a manufacturing method for them.

SOLUTION: Before or at peeling of the functional film, a procedure for degrading adhesive force, such as temperature processing, light irradiation, moisture adsorption or liquid treatment, or a combination of them is performed, depending on the type of the film to be peeled. Thereby, after completing the purpose of the functional film of fixing a semiconductor chip, the film can be peeled off quickly.

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