PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM RESIST USING THE SAME AND FLEXIBLE PRINTED WIRING BOARD USING PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST AS COVER LAY

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition useful as a cover lay of a flexible printed board and a photosensitive dry film resist using the same.

SOLUTION: The photosensitive resin composition has 50-500 MPa elastic modulus, 50-500 ppm coefficient of thermal expansion, ≤60°C Tg (glass transition temperature), ≤5 mm warpage, ≤4% water absorption, ≥1012Ω insulation resistance, ≤100 hr migration resistance and ≥300°C soldering heat resistance after exposure and curing. The photosensitive dry film resist is obtained using the photosensitive resin composition.

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