LED sub-mount and method for manufacturing light emitting device using the sub-mount

摘要

A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.

主权项

1. A light emitting diode device comprising:
a substrate body having a first surface; a plurality of first electrical-conductive layers disposed on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove, and the adjacent two of the first electrical-conductive layers are in direct contact with an outer side surface of the adhesive-filling groove and not in direct contact with an inner side surface of the adhesive-filling groove; an LED chip mounted on the first surface by a flip-chip way, the LED chip having both two electrodes confronting and being in direct contact with the adjacent two of the first electrical-conductive layers; and a cured glue disposed within the adhesive-filling groove and being aligned immediately below the LED chip, and the cured glue being sandwiched between and in direct contact with both the LED chip and the substrate body.