| 摘要 |
A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.
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