POLYAMIDE HOT MELT ADHESIVE COMPOSITION COMPRISING ACID COMPONENT COMPRISING FATTY ACID, C2-C18 ALIPHATIC DICARBOXYLIC ACID AND DIMERIZED ROSIN ACID OR MALEIC ANHYDRIDE-MODIFIED ROSIN ACID, AND AMINE COMPONENT COMPRISING C2-C8 ALIPHATIC DIAMINE, POLYETHER-BASED DIAMINE AND HETERO ALICYCLIC AMINE

摘要

PURPOSE: Provided is a polyamide hot melt adhesive composition which is excellent in the adhesive strength to various substrates, particularly polyolefin, can be adhered to polyolefin without primer process, and is reduced in the tackiness of surface after used to prepare an adhesive sheet or coated on a substrate. CONSTITUTION: The polyamide hot melt adhesive composition comprises an acid component which comprises 60-98 wt% of a fatty acid, 1-40 wt% of a C2-C18 aliphatic dicarboxylic acid and 1-30 wt% of the dimerized rosin acid represented by the formula I or the maleic anhydride-modified rosin acid represented by the formula II; and an amine component which comprises 40-90 wt% of a C2-C8 aliphatic diamine, 0-60 wt% of a polyether-based diamine and 5-20 wt% of a hetero alicyclic amine. The ratio of the acid component and the amine component is 1 : 0.95-1.1 by mol.