SYMMETRICAL PIEZORESISTIVE PRESSURE SENSOR WITH STACKING ICs

摘要

Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

主权项

1. A microelectromechanical system (MEMS) pressure sensing element comprising:
a first silicon substrate having a top surface having a plurality of bond pads, which are symmetrically distributed on the top surface; and a conductive loop carrying a fixed voltage and which circumscribes the plurality of bond pads, the conductive loop being symmetrically distributed on the top surface.