| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small hybrid integrated circuit device at a low cost, which totally ensures sufficient allowable electric power even in the case of both a heating element and a temperature-restricted element mounted on the same circuit substrate. <P>SOLUTION: The hybrid integrated circuit device 101 is wholly molded with resin 1. Therein, a circuit substrate 3 with a heating element 41 and a temperature-restricted element 51 is mounted on the seat 2a of a lead frame 2, and a hollowed out part 20 is formed in a corresponding position between the heating element 41 and temperature-restricted element 51 on the seat 2a. <P>COPYRIGHT: (C)2004,JPO |
