| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a protection membrane with which a protection membrane having small residual stress and an excellent moisture-proof performance can be formed and which does not give thermal damages to the film-formed object. <P>SOLUTION: The protection membrane 5 covering the organic EL layer of an organic EL element has a three-layered structure made of a high-density silicon nitride membrane 52 having compressive stress and a low-density silicon nitride membranes 51, 53 having tensile stress formed so as to clip it. Since the compressive stress layer and the tensile stress layer are alternately laminated, the residual stress of the whole protection membrane 5 is made reduced. As a result, the protection membrane 5 becomes hard to be peeled off. Furthermore, since it has a fine high-density silicon nitride membrane 52, the protection membrane 5 has an excellent moisture-proof performance. Furthermore, as the silicon nitride membranes 51-53 are formed by a high-density plasma CVD method, the film-forming temperatures can be made low and the thermal damages to the organic EL element can be reduced. <P>COPYRIGHT: (C)2004,JPO |
