发明名称 SURFACE-MOUNT ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface-mount electronic component module which is equipped with a necessary inductance element, can be made small, short, and lightweight, and is increased in the degree of freedom of mounting position of electronic component elements on a wiring board. <P>SOLUTION: The surface-mount electronic component module includes a wiring board having wiring patterns formed on one side and external connection terminals formed on the other side, and the wiring patterns and the external connection terminals connected with each other by via holes or through holes; a plurality of electronic component elements mounted on the one side of the wiring board; and an exterior resin layer formed on the wiring board which covers the plurality of electronic component elements, wherein at least one of the plurality of electronic component devices is fastened with its face up on the one side of the wiring board, the connection terminal of the electronic component device fastened face up, and the wiring pattern or the connection terminal of another electronic component element connected with each other with a wire. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004095633(A) 申请公布日期 2004.03.25
申请号 JP20020251257 申请日期 2002.08.29
申请人 FUJITSU MEDIA DEVICE KK 发明人 FURUKAWA OSAMU;MURATA TOSHIHIKO;IGATA OSAMU
分类号 H01L25/18;H01L21/98;H01L25/04;H01L25/065;H01L25/16;H03H3/08;H03H9/64 主分类号 H01L25/18
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