| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump forming method/device which do not require a shaping process of a bump without a possibility of an abnormal shape in the bump, and in which a member dealing with a bump material can easily be exchanged, position precision of the member after exchange can easily be detected, a bump forming process can be shortened and cost is made less. <P>SOLUTION: In the bump forming method, a bump ball 22 is supplied into a positioning hole 34 of a bump ball arranging plate 23. A bonding pad 37 of a wafer 17 is brought into contact with an upper end of the bump ball 22, and a plate 31 is heated in a state where the wafer 17 is depressed at a wafer holding pad 13a. Thus, the bump ball 22 is pressed and deformed, and a bump 38 in a prescribed shape is obtained. <P>COPYRIGHT: (C)2004,JPO |
