发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with its quality and reliability enhanced by reducing the region of a sealing resin 6 along the edges of a semiconductor element 2 for stress alleviation along the edges. <P>SOLUTION: The semiconductor device comprises a semiconductor device carrier 3 which is an insulating substrate having on its top surface a wiring pattern connected to a plurality of electrodes 4 and, on its bottom surface, external connection terminals 7 electrically connected to the electrodes 4 and to wirings; a semiconductor element 2 connected by a plurality of bump electrodes to the electrodes 4 on the top surface of the semiconductor device carrier 3; and a sealing resin 6 for filling and coating gaps between the semiconductor element 2 and the semiconductor device carrier 3, and for providing a coating along the edges of the semiconductor element 2. Of the sealing resin 6 coating the semiconductor device carrier 3 along the edges of the semiconductor element 2, the part coating one of the edges is cut off for the cross section of the sealing resin 6 to be roughly vertical to the surface of the semiconductor device carrier 3. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004119481(A) |
申请公布日期 |
2004.04.15 |
申请号 |
JP20020277569 |
申请日期 |
2002.09.24 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NONOYAMA SHIGERU;AKABOSHI TOSHITAKA;NAKAOKA YUKIKO;KAWAKAMI YOSHIHIKO;ITO SEIICHI |
分类号 |
H01L23/28;H01L21/56;H01L21/60;H01L23/12 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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