| 发明名称 |
Method for polishing leads for semiconductor packages |
| 摘要 |
In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.
|
| 申请公布号 |
US6726533(B2) |
申请公布日期 |
2004.04.27 |
| 申请号 |
US20010994820 |
申请日期 |
2001.11.28 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SATO TAKEYUKI |
| 分类号 |
B24B29/00;B24B29/02;H01L21/48;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
B24B29/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
