发明名称 Resin-packaged led light source
摘要 An LED light source includes a rectangular LED chip and a transparent resin package enclosing the LED chip. The resin package is provided with a lens portion for directing light emitted from the LED chip to the outside of the resin package. The LED chip includes two adjacent side surfaces oriented toward the lens portion.
申请公布号 US2004080268(A1) 申请公布日期 2004.04.29
申请号 US20030394489 申请日期 2003.03.19
申请人 ROHM CO., LTD. 发明人 UEDA TAKASHI
分类号 H01J9/227;H01L33/30;H01L33/38;H01L33/54;H01L33/56;H01L33/62;H05B33/04;(IPC1-7):H01J1/62 主分类号 H01J9/227
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