发明名称 |
Resin-packaged led light source |
摘要 |
An LED light source includes a rectangular LED chip and a transparent resin package enclosing the LED chip. The resin package is provided with a lens portion for directing light emitted from the LED chip to the outside of the resin package. The LED chip includes two adjacent side surfaces oriented toward the lens portion.
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申请公布号 |
US2004080268(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030394489 |
申请日期 |
2003.03.19 |
申请人 |
ROHM CO., LTD. |
发明人 |
UEDA TAKASHI |
分类号 |
H01J9/227;H01L33/30;H01L33/38;H01L33/54;H01L33/56;H01L33/62;H05B33/04;(IPC1-7):H01J1/62 |
主分类号 |
H01J9/227 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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