| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a backlight to improve assembling characteristic and assembling precision, and improve the brightness of a light guide plate. <P>SOLUTION: This backlight is provided with the light guide plate, a surface-mounting type semi-conductor light emitting device arranged on a side face of this light guide plate, a flexible substrate on which this semi-conductor light emitting device is mounted, and a holder to retain the light guide plate and the semi-conductor light emitting device with a gap. An opening is formed at a position adjacent to the gap of the holder, and an adhesive layer with a translucency to be jointed to the light guide plate and the semi-conductor light emitting device is formed in the gap. After the light guide plate and the semi-conductor light emitting device are respectively and separately incorporated into the holder, adhesive to form an adhesive layer can be filled from the opening, and solidified. <P>COPYRIGHT: (C)2004,JPO |
