发明名称 METHOD OF PROCESSING SUCCESSIVE MODULE STEPS HAVING EXPOSURE PROCESS
摘要 PURPOSE: A method of processing successive module steps having an exposure process is provided to be capable of simplifying the process for reducing process cost and improving productivity. CONSTITUTION: The first photoresist pattern(41) is formed on a predetermined structure(1) for progressing pre-module step. The first main process of the pre-module step is carried out on the resultant structure by using the first photoresist pattern. A photoresist layer(50) is applied on the entire surface of the resultant structure. The second photoresist pattern is formed by carrying out exposure and development on the photoresist layer for progressing post-module step. The second main process of the post-module step is carried out on the resultant structure by using the second photoresist pattern.
申请公布号 KR20040051203(A) 申请公布日期 2004.06.18
申请号 KR20020079089 申请日期 2002.12.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SEONG UI
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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