发明名称 METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD BY FORMING CENTER LAYER IN INTERMEDIATE PORTION OF BASE
摘要 PURPOSE: A method is provided to maintain strength of a base and allow for ease of handling of the base, by forming a center layer in the intermediate portion of the base. CONSTITUTION: A method comprises a step of providing a base(20) having first metal thin films(23) arranged at both sides of a center layer(21) and etching resist layers formed at surfaces of the first metal thin films; a step of forming a plating groove for exposing the first meal thin films by selectively removing the etching resist layers of the base; a step of forming a connection protrusion(27) by performing a plating process on the first metal thin films exposed through the plating groove; a step of removing the etching resist layers, and forming insulating layers on the first metal thin films such that the front end of the connection protrusion is exposed; a step of disposing second metal thin films(29) on the insulating layers and the connection protrusion; a step of cutting edges of the base such that two sections are obtained centering from the center layer; and a step of forming a circuit pattern by using the first or second metal thin film of one of two sections of the base.
申请公布号 KR100442918(B1) 申请公布日期 2004.07.23
申请号 KR20030007572 申请日期 2003.02.06
申请人 LG ELECTRONICS INC. 发明人 LEE, SUNG GUE;HWANG, JUNG HO;HAN, JOON WOOK;LEE, SANG MIN;EO, TAE SIK;YANG, YU SEOK
分类号 H05K3/46;H05K1/11;H05K3/40;(IPC1-7):H05K3/46 主分类号 H05K3/46
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