发明名称 |
METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD BY FORMING CENTER LAYER IN INTERMEDIATE PORTION OF BASE |
摘要 |
PURPOSE: A method is provided to maintain strength of a base and allow for ease of handling of the base, by forming a center layer in the intermediate portion of the base. CONSTITUTION: A method comprises a step of providing a base(20) having first metal thin films(23) arranged at both sides of a center layer(21) and etching resist layers formed at surfaces of the first metal thin films; a step of forming a plating groove for exposing the first meal thin films by selectively removing the etching resist layers of the base; a step of forming a connection protrusion(27) by performing a plating process on the first metal thin films exposed through the plating groove; a step of removing the etching resist layers, and forming insulating layers on the first metal thin films such that the front end of the connection protrusion is exposed; a step of disposing second metal thin films(29) on the insulating layers and the connection protrusion; a step of cutting edges of the base such that two sections are obtained centering from the center layer; and a step of forming a circuit pattern by using the first or second metal thin film of one of two sections of the base.
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申请公布号 |
KR100442918(B1) |
申请公布日期 |
2004.07.23 |
申请号 |
KR20030007572 |
申请日期 |
2003.02.06 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, SUNG GUE;HWANG, JUNG HO;HAN, JOON WOOK;LEE, SANG MIN;EO, TAE SIK;YANG, YU SEOK |
分类号 |
H05K3/46;H05K1/11;H05K3/40;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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