发明名称 LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device and its manufacturing method that has a structure to prevent arrival of oxygen or arrival of moisture at a light emitting element. <P>SOLUTION: This light emitting device and its manufacturing method are characterized in that the device has a structure to paste a substrate 11 with the light emitting element mounted thereon together with the opposing 12, and such a material that the viscosity is put back into the original state after a shearing stress is removed is used, wherein if there is the shearing stress which is generated between the substrate 11 and the sealant and generated by the pressure in pasting the substrate 11 to the opposing 12, the viscosity of the sealant is reduced, when a sealant is uncured. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004213910(A) 申请公布日期 2004.07.29
申请号 JP20020378691 申请日期 2002.12.26
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NISHI TAKESHI;SAKAI YURIE
分类号 H05B33/04;H01L51/50;H05B33/10;H05B33/14 主分类号 H05B33/04
代理机构 代理人
主权项
地址