发明名称 Cooling system for hinged portable computing device
摘要 A cooling system for a hinged portable computing device is provided having a first passive heat transfer device is carried within a first housing portion of the computer and a second passive heat transfer device that is carried within a second housing portion of the portable computer. A hinge structure interconnects the first and second housing portions for pivotal movement relative to one another, where the hinge structure includes a heat conductive first gudgeon having a pintle and a thermal interface block. The thermal interface block is disposed in the second housing portion and connected in thermal communication with the second first passive heat transfer device. A heat conductive second gudgeon is also provided having a journal and a thermal interface block. The thermal interface block of the second gudgeon is connected in thermal communication with the first passive heat transfer device, and the pintle is rotatably received within the journal so as to be in heat exchange relationship with the second gudgeon, thereby forming an integral portion of the hinge structure. In one embodiment, a third passive heat transfer device is also employed within the first housing portion of the computer.
申请公布号 US6771498(B2) 申请公布日期 2004.08.03
申请号 US20020280726 申请日期 2002.10.25
申请人 THERMAL CORP. 发明人 WANG HWAI-MING;CHIANG WEI-CHIEH;LIU HSIEN-TSANG
分类号 G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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