| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which gives a cured product having excellent resolution and thermal shock resistance and preferable adhesiveness. <P>SOLUTION: The positive photosensitive resin composition contains: a copolymer (A) expressed by general formula (1): (X)<SB>m1</SB>-(Y)<SB>n</SB>-(X)<SB>m2</SB>, wherein X is a structural unit having a structural unit expressed by formula (2) by ≥10 wt.%, with R in formula (2) representing a hydrogen atom or a 1-4C alkyl group, and Y is a structural unit derived from a carbon-carbon double bond compound under the condition that a (co)polymer having Y as the structural unit shows ≤0°C glass transition temperature (Tg); a compound (B) having a quinone diazide group; a compound (C) having at least two or more alkyl ether-ized amino groups in the molecule; a heat sensitive acid generating agent (D); and an organic solvent (E). <P>COPYRIGHT: (C)2004,JPO&NCIPI |
