发明名称 Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data
摘要 Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.
申请公布号 US6797526(B2) 申请公布日期 2004.09.28
申请号 US20020232871 申请日期 2002.08.30
申请人 HITACHI, LTD. 发明人 TANAKA MAKI;MAEDA SHUNJI;NOGUCHI MINORI;OKABE TAKAFUMI;TAKAGI YUJI;SHISHIDO CHIE
分类号 H01L21/00;H01L21/66;(IPC1-7):H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址