METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem that a thin wafer cannot be pasted to a dicing sheet because a conventional adhesive film hardens partially to cause warpage of the thin wafer when the adhesive film is pasted to collective electronic components on the thin wafer.

SOLUTION: Under a temperature not lower than the melting point of an adhesive film and not higher than the reaction start point, the adhesive film is pasted to thin collective electronic components and then thin electronic components are diced thus preventing the thin electronic component from warping after the adhesive film is pasted.

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