发明名称 IC CARD AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC card and manufacturing method thereof which can realize improvement in workability and productivity, while maintaining reliability of connection between a tab substrate and a card body. <P>SOLUTION: This IC card is a dual interface card (IC card) C1 which is provided with the card body 34, a tab substrate 35 which has on the surface an external electrode 45 for contact-type communications fixed in reentrant 39 formed at the card body 34 through adhesive materials 40, and an IC chip 41 electrically connected to the external electrode 45. The tab substrate 35 is provided with a light-transmitting part which transmits ultraviolet rays in the direction of front-to-reverse side, while the adhesive materials 40 are composed of ultraviolet-hardening type adhesive materials. By this composition the adhesive materials 40 enclosed in the reentrant 39 are made possible to be cured for a short time, so that improvement in workability and productivity can be realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004334639(A) 申请公布日期 2004.11.25
申请号 JP20030131312 申请日期 2003.05.09
申请人 SONY CORP 发明人 TAKAHASHI ISAO
分类号 B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/10
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