| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sheet for holding a wafer which can utilize the physical characteristics of other sheet materials and polyurethane foam in the sheet for holding the wafer applied to a wafer polishing apparatus. <P>SOLUTION: The sheet 22 for holding the wafer is constituted by adhering a film-like polyurethane foam 28 to a sheet-like base material 24 for holding the wafer W via a double-sided bonding tape 26. The base material 24 is made of a polyethylene of a member having a percentage elongation after fracture stipulated by JIS C2151 of 150% or more. The member made of a low surface energy plastic, such as a polypropylene, etc., instead of the polyethylene can be applied. The polyurethane foam 28 may be formed directly on the base material 24 by a direct forming means, such as a wet type foaming, etc. without using the double-sided bonding tape 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
