发明名称 POLISHING PAD CONDITIONING METHOD FOR IMPROVING LIFETIME OF POLISHING PAD AND REMOVING COMPLETELY SLURRY FROM GROOVES OF POLISHING PAD
摘要 PURPOSE: A polishing pad conditioning method is provided to improve the lifetime of a polishing pad by conditioning the polishing pad using a brush and to remove completely slurry from grooves of the pad by spraying water onto the pad. CONSTITUTION: A surface of a polishing pad(1) is scrubbed by using a plurality of brushes(21) with a predetermined diameter while a nozzle(23) over the polishing pad sprays water onto the polishing pad. Water spraying pressure is larger 5 times or more than atmospheric pressure. Each brush is made of polyurethane and has a diameter of 30 m or less.
申请公布号 KR20050005959(A) 申请公布日期 2005.01.15
申请号 KR20030045954 申请日期 2003.07.08
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 YOON, IL YOUNG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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