发明名称 |
POLISHING PAD CONDITIONING METHOD FOR IMPROVING LIFETIME OF POLISHING PAD AND REMOVING COMPLETELY SLURRY FROM GROOVES OF POLISHING PAD |
摘要 |
PURPOSE: A polishing pad conditioning method is provided to improve the lifetime of a polishing pad by conditioning the polishing pad using a brush and to remove completely slurry from grooves of the pad by spraying water onto the pad. CONSTITUTION: A surface of a polishing pad(1) is scrubbed by using a plurality of brushes(21) with a predetermined diameter while a nozzle(23) over the polishing pad sprays water onto the polishing pad. Water spraying pressure is larger 5 times or more than atmospheric pressure. Each brush is made of polyurethane and has a diameter of 30 m or less.
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申请公布号 |
KR20050005959(A) |
申请公布日期 |
2005.01.15 |
申请号 |
KR20030045954 |
申请日期 |
2003.07.08 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
YOON, IL YOUNG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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