发明名称 |
Wafer-level seal for non-silicon-based devices |
摘要 |
One embodiment disclosed relates to a method for sealing an active area of a non-silicon-based device on a wafer. The method includes providing a sacrificial material over at least the active area of the non-silicon-based device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to a non-silicon-based device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, a contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the contact area exposed.
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申请公布号 |
US6846423(B1) |
申请公布日期 |
2005.01.25 |
申请号 |
US20020231357 |
申请日期 |
2002.08.28 |
申请人 |
SILICON LIGHT MACHINES CORPORATION |
发明人 |
MILLER GREGORY D.;BRUNER MIKE |
分类号 |
B81B7/00;H03H3/08;H03H9/02;(IPC1-7):H01L21/54;H01L41/22 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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