| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive contact type/non-contact type hybrid IC card. <P>SOLUTION: This contact type/non-contact type hybrid IC module 10 is configured by forming a connection terminal on one face of an insulating substrate, and forming a connection pattern and a pattern connected to an antenna for a non-contact IC card incorporated at the card substrate side on the other face of the insulating substrate. A contact type IC chip and a non-contact type chip are mounted on the other face of the insulating substrate in a status that the back faces of those IC chips are adhered to each other, and they are electrically connected, and resin-sealed and completed. This contact type/non-contact type hybrid IC card is configured by incorporating an antenna coil for the non-contact IC chip in the card substrate, and exposing the antenna coil in a recess in which the contact type/non-contact type hybrid IC module of the card substrate is fit. Then, the contact type/non-contact type hybrid IC module is fit in the recess, and electrically connected and adhered. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
