发明名称 MODULE WITH BUILT-IN CIRCUIT COMPONENTS, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a module with built-in circuit components and its manufacturing method which solves the wire-breaking or short-circuit problem, using the wire bonding method being a low-cost mounting process. <P>SOLUTION: The module 100 comprises an electric insulating board 101 made of a first mixture containing a filler and a thermosetting resin, wiring patterns 102, 103 formed on at least a main surface of the insulating board 101, circuit components 105 disposed in the insulating board 101 with the wiring patterns 102, 103 electrically connected to thereto, and vias 104 formed to electrically connect the wiring patterns 102, 103. At least one of the circuit components 105 is mounted with wires a part or the entire of which is sealed with a second mixture 109 composed of a filler and a resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101580(A) 申请公布日期 2005.04.14
申请号 JP20040247087 申请日期 2004.08.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIMARU YUKIHIRO;SUGAYA YASUHIRO;ASAHI TOSHIYUKI
分类号 H01L23/29;H01L23/12;H01L23/31;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/29
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