发明名称 Flexible flat conductor and printed circuit board connecting method, involves heating applied brazing deposit through opening, present in or against electro-conducting zone, traversing conductor for soldering conductor to board
摘要 <p>The method involves applying a brazing deposit (3) to an electro-conducting contact zone (11) of a printed circuit board (1). An electro-conducting contact zone (21) is presented on a side of a flat conductor (2) pointed towards the board and is set in contact with the deposit. The deposit is heated through an opening (23), present in or against the zone (21), traversing the conductor so that the conductor is soldered with the board. Independent claims are also included for the following: (a) a flexible flat conductor (b) a group of electronic components with printed circuit board and flat conductor.</p>
申请公布号 FR2860945(A1) 申请公布日期 2005.04.15
申请号 FR20040010782 申请日期 2004.10.13
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 HELMUT HEINZ;SIBYLL KONIG
分类号 H01R43/02;H05K3/34;H05K3/36;(IPC1-7):H05K3/34 主分类号 H01R43/02
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