| 发明名称 | Method for fabricating an interposer | ||
| 摘要 | A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield. | ||
| 申请公布号 | US9515048(B2) | 申请公布日期 | 2016.12.06 |
| 申请号 | US201514744464 | 申请日期 | 2015.06.19 |
| 申请人 | Siliconware Precision Industries Co., Ltd. | 发明人 | Wu Wen-Kuang;Yuan Tsung-Te;Lu Chun-Hung |
| 分类号 | H01L23/00;H01L21/78;H01L21/683;H01L23/522 | 主分类号 | H01L23/00 |
| 代理机构 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. | 代理人 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. ;Corless Peter F.;Jensen Steven M. |
| 主权项 | 1. A method for fabricating an interposer, comprising the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; after performing the singulation process, bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers. | ||
| 地址 | Taichung TW | ||