Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant

摘要

A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts.

主权项

1. A semiconductor device, comprising:
a base plate including a plurality of conductive posts physically connected to and extending from the base plate; an encapsulant disposed over the base plate and around the conductive posts including a height of the encapsulant equal to a height of the conductive posts; and a semiconductor die embedded within the encapsulant between the conductive posts including a height of the semiconductor die less than the height of the conductive posts.