Thermal interface materials

摘要

A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.

主权项

1. A thermal interface material configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device, the thermal interface material comprising a first material including polymer and a second material including a contact resistance reducing material to thereby reduce surface contact resistance between the first material and heat generating and/or heating removing components of the electronic device, wherein a distinct layer of the second material is applied to and disposed along a side surface of the first material, and wherein:
the second material has a phase change softening temperature less than 125 degrees Celsius; and the second material conforms to a thermal transfer surface when the thermal interface material is installed and the second material is between the first material and the thermal transfer surface, whereby the second material fills interstitial voids of the thermal transfer surface and/or reduces air gaps between the first material and the thermal transfer surface.